Our paper "Full Wafer Redistribution and Wafer Embedding as Key Technologies for a Multi-Scale Neuromorphic Hardware Cluster" was accepted at the 19th Electronics Packaging Technology Conference 2017. EPTC-2017
Furthermore, we will present a poster about the subjects of the paper at the International Wafer-Level Packaging Conference in San Jose. IWLPC
Last update of this page: 2017-09-28 by gguettle
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